A new electronics manufacturing technology developed at North Dakota State University eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.
Recently the NDSU researchers successfully implemented the technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate.
A key part ois the patent-pending process, Thermo-Mechanical Selective Laser Assisted Die Transfer. This process selectively and rapidly places ultra-thin (<50 µm) semiconductor chips at specific locations and orientations with high precision.
Learn more about this process at the NDSU Center for Nanoscale Science and Engineering.
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