Wednesday, October 26, 2011

NDSU Develops Laser-Enabled Electronic Packaging

A new electronics manufacturing technology developed at North Dakota State University eliminates challenges facing conventional packaging techniques and shows promise to significantly reduce the size and unit cost of microelectronic devices. The technology, called Laser-Enabled Advanced Packaging has the potential to enable high-volume handling, placement and interconnection of microelectronic components smaller than ever before possible.

Recently the NDSU researchers successfully implemented the technology to fabricate the first-ever functional electronic device with a laser-assembled, ultra-thin silicon chip embedded in a flexible substrate.

A key part ois the patent-pending process, Thermo-Mechanical Selective Laser Assisted Die Transfer. This process selectively and rapidly places ultra-thin (<50 ┬Ám) semiconductor chips at specific locations and orientations with high precision.

Learn more about this process at the NDSU Center for Nanoscale Science and Engineering.

Tuesday, October 25, 2011

The Electronics Industry in Southeast Asia

Report Linker has posted a new study covering export and manufacturing trends in Southeast Asia.  The study provides an analysis on the performance, size and growth opportunities. Key segments covered in this study include Semiconductors (ICs) , consumer electronics, electronic components, peripherals, personal computers, HDD, and storage . The study focuses on three countries Singapore, Malaysia and Thailand.

Read the study here:

Monday, October 24, 2011

UK Electronics Alliance Counterfeit Component Survey

In an attempt to measure the size of the counterfeit problem for UK businesses the UKEA has released a survey. All responses are entirely confidential. The UKEA is not asking for contact details and they will be unable to see who has responded as each response carries only a date and time stamp.

If you are only able to cite one example of counterfeiting, please complete this survey

If you are able to cite, multiple examples of counterfeiting, please complete this survey

Friday, October 21, 2011

Vehicle failures due to electronic components increasing yearly

Electronic components are involved in nearly half of all emergency assistance calls, often coming from screws, microscopic contamination particles on interconnects regularly cause failures in control units. As a result, components costing only a few cents are responsible for costs amounting to several hundred dollars.

The Cleancon concept developed by Arnold Umformtechnik creates a solution and represents a milestone in avoiding vehicle failures due to electronic components. A combination of the systematic coordination of all parameters affecting the cleanliness of components, cleanliness-oriented production, microcleaning and low-friction coating, and packaging of fastening components under cleanroom conditions allows substantially better cleanliness figures to be achieved.

More information is available at

Thursday, October 20, 2011

HEICO to Acquire Switchcraft

HEICO Corporation today announced that its Electronic Technologies Group entered into a definitive agreement to acquire Switchcraft, Inc. through the purchase of all of the stock of Switchcraft's parent company, Switchcraft Holdco. Inc., from its management and other private equity ownership under financial terms which were not disclosed.

Read the full press release here

Wednesday, October 19, 2011

Northwestern Scientists Develop New Nanomaterial that can Steer Electrical Currents

The Northwestern team has made reconfigurable electronic materials: materials that can rearrange themselves to meet different computational needs at different times. This development could lead to a computer that can simply reconfigure its internal wiring and become an entirely different device, based on changing needs.

"Our new steering technology allows use to direct current flow through a piece of continuous material," said Bartosz A. Grzybowski, who led the research. "Like redirecting a river, streams of electrons can be steered in multiple directions through a block of the material -- even multiple streams flowing in opposing directions at the same time."

The Northwestern material combines different aspects of silicon- and polymer-based electronics to create a new classification of electronic materials: nanoparticle-based electronics.

The study, in which the authors report making preliminary electronic components with the hybrid material, is available at the the journal Nature Nanotechnology.

Wednesday, October 12, 2011

TE Now on S&P 500

Keep an eye on shares of  TE Connectivity (NYSE:TEL). Late yesterday, Standard & Poor's said TE Connectivity would join the S&P 500 index following the close of trading on Friday.

It will replace Cephalon (NASDAQ:CEPH) which is due to be acquired by Teva Pharmaceuticals (NASDAQ:TEVA).

Tuesday, October 11, 2011

Free October 26th Freescale Webinar Xtrinsic Sensor Solutions

Xtrinsic Sensor Solutions: Unlocking Applications with Optimal Sensing Technologies

Wednesday, October 26 at 12 PM CDT

Learn about next generation Xtrinsic sensor products and applications from a Freescale engineer. Q&A to follow the 45 minute presentation.

Join Freescale's Michelle Kelsey, from Magnetic Sensors, who will introduce you to a new world of sensing possibilities: 

• Develop an understanding of the Xtrinsic Sensor portfolio, terminology and market trends, and features being implemented in applications.
• Xtrinsic Sensor products and features.
• Learn about the broad suite of sensor development tools & enablement software that will get your designs to market faster, with better performance and at a lower cost.
• Learn about how Freescale’s Xtrinsic Sensor products can enhance your applications, reduce power consumption for green initiatives, and save overall system costs.

 Register here

Monday, October 10, 2011

Allied Releases 2012 Catalog

The 2012 catalog shows more than 12,000 new products from more than 300 suppliers.  What's especially nice to see is the new catalog meets the sustainable forestry initiative certification, meaning all paper used in the catalog was obtained from the SFI program, which integrates the perpetual growing and harvesting of trees with the protection of wildlife, plants, soil, water and air quality.
To request a free copy of the 2012 Allied Catalog, visit

Tuesday, October 4, 2011

Find a Connector

Choosing the right electrical connector may be one of the most important interconnection decisions to make in a product’s design.

Newark connectors offers a pictorial index / selector guide of connectors they distribute. Shop by representative products, type, manufacturer, cable styles, tubing, accessories as well as options to consider. 

The guide should help designers modularize, downsize, and improve manufacturability and field maintenance for a variety of applications.

Monday, October 3, 2011

Fiber Optic Connector Identifier

In the development of fiber optic technology over the last 30 years, many companies and individuals have invented the "better mousetrap" - a fiber optic connector that was lower loss, lower cost, easier to terminate or solved some other perceived problem. In all, about 100 fiber optic connectors have been introduced to the marketplace, but only a few represent the majority of the market. The Fiber Optic Association has created a rundown of the connectors that have been the leaders of the industry.